一路 BBS

标题: iPhone 6晶片投產 台積大贏家 [打印本页]

作者: choi    时间: 3-5-2014 12:21
标题: iPhone 6晶片投產 台積大贏家
涂志豪, iPhone 6晶片投產 台積大贏家. 工商時報, Mar 5, 2014.
www.chinatimes.com/newspapers/20140305000138-260204

Note:
(a) I do not know what 法人 means in this context.
(b) "LCD驅動IC仍由原供應商日本瑞薩子公司RSP負責"
(i) 瑞薩電子 (name in Taiwan)  Renesas Electronics
en.wikipedia.org/wiki/Renesas_Electronics
(section 1 Name)
(ii) RSP stands for
  
Renesas SP Drivers Inc
www.rsp.renesas.com/en/index.htm
("a joint venture established by Renesas Electronics, Sharp Corporation and Powerchip Group in April 2008. It engages in the business of LCD Drivers that drive small and mid-sized LCD panels")   

My guess is SP is the first letters of Sharp and Powerchip.

(c) 恩智浦  
www.nxp.com/about.html
(Table: Net Revenue: $4.82 billion (2013); Established: 2006 (formerly a division of Philips); Headquarters: Eindhoven, The Netherlands)

is a IC designer.
作者: choi    时间: 3-5-2014 12:21
Taiwan's TSMC making chips for new iPhone. AFP, Mar 5, 2014 (6 hours ago)
www.google.com/hostednews/afp/ar ... uaWr7apq-l52ANLDbQg
("Taipei-based website TechNews has claimed TSMC will now become the sole manufacturer of the A8 chips")

My comment:
(a) This report is marked "highly cited" by Google News.
(b) The report is based on the Commercial News report above, but adds its own reporting. After all, The Commercial News report does not says whether Samsung participates in A8 fabrication.





欢迎光临 一路 BBS (http://www.yilubbs.com/) Powered by Discuz! X3.2