TSMC Gets Apple's Chip Contract: Speculation

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(1) 簡永祥 and 陳碧珠, 台積明年資本支出 外傳達3,000億. 經濟日報 Economic Daily News (EDN), Sept 10, 2012.
http://udn.com/NEWS/FINANCE/FIN3/7352071.shtml
("據了解，台積電明年百億美元資本支出，除了購買昂貴的微影設備外，還包括竹科第6期、以及中科和南科超大型晶圓廠產能持續布建；製程除了28奈米外，主要為20奈米產能建置，以及16奈米鰭式場效應晶體（FinFET）技術研發")

Note:
(a) 中央日報‎ (Chinese edition) summaries the report.
(b) Cens.com (English edition) of Taiwan summaries the report.

Ken Liu, TSMC Said to Set Capex at US$10B for 2013 Amid Apple Contract Report. Taiwan Economic News, Sept 10, 2012.
http://news.cens.com/cens/html/en/news/news_inner_41368.html

More than translate the EDN report, CENS report, adds tibits of gems. For example:
(i) I did not know what 微影 (in the quotation above) was. it turns out to be "lithography."
(ii) EDN did not name the official but CENS does: "At a forum held a few days ago, TSMC’s vice president for research and development, Burn Lin, pointed out that TSMC will begin volume production of FinFET transistors at 20nm process and is on the track to deploy 16nm FinFET process soon.

(2) Taiwan Semiconductor Manufacturing Co (TSMC) today (Sept 10) announces August revenue of $1.66 billion, which is 2%hike from July but 31.5% increase from August a year earlier.