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iPhone 6晶片投產 台積大贏家

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楼主
发表于 3-5-2014 12:21:44 | 只看该作者 回帖奖励 |倒序浏览 |阅读模式
涂志豪, iPhone 6晶片投產 台積大贏家. 工商時報, Mar 5, 2014.
www.chinatimes.com/newspapers/20140305000138-260204

Note:
(a) I do not know what 法人 means in this context.
(b) "LCD驅動IC仍由原供應商日本瑞薩子公司RSP負責"
(i) 瑞薩電子 (name in Taiwan)  Renesas Electronics
en.wikipedia.org/wiki/Renesas_Electronics
(section 1 Name)
(ii) RSP stands for
  
Renesas SP Drivers Inc
www.rsp.renesas.com/en/index.htm
("a joint venture established by Renesas Electronics, Sharp Corporation and Powerchip Group in April 2008. It engages in the business of LCD Drivers that drive small and mid-sized LCD panels")   

My guess is SP is the first letters of Sharp and Powerchip.

(c) 恩智浦  
www.nxp.com/about.html
(Table: Net Revenue: $4.82 billion (2013); Established: 2006 (formerly a division of Philips); Headquarters: Eindhoven, The Netherlands)

is a IC designer.
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沙发
 楼主| 发表于 3-5-2014 12:21:51 | 只看该作者
Taiwan's TSMC making chips for new iPhone. AFP, Mar 5, 2014 (6 hours ago)
www.google.com/hostednews/afp/ar ... uaWr7apq-l52ANLDbQg
("Taipei-based website TechNews has claimed TSMC will now become the sole manufacturer of the A8 chips")

My comment:
(a) This report is marked "highly cited" by Google News.
(b) The report is based on the Commercial News report above, but adds its own reporting. After all, The Commercial News report does not says whether Samsung participates in A8 fabrication.
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